April 3, 2008
For Immediate Release
Pat Meier Associates PR
Small Form Factor SIG Adopts VIA's Pico-ITX Specification
VIA transfers Pico-ITX™ to the SIG to standardize it as an embedded
platform for ultra mobility silicon and broaden the market
Taipei, Taiwan, 3 April 2008 - VIA Technologies, Inc, a leading
innovator of power efficient `x86 processor platforms, today announced
that it has agreed to transfer the Pico-ITX™ specification to the Small
Form Factor Special Interest Group (SFF-SIG), which is leading a broad
industry effort to create and promote standards for tiny computer and
controller boards and modules, for the purpose of creating an official
In return, the SFF-SIG will draft a formal specification document and
promote it with the goal of broadening the number of suppliers and
customers who build and purchase Pico-ITX-compatible single board
computers (SBCs). The SFF-SIG intends to publish a specification within
the next few months.
As a worldwide organization that seeks to identify and standardize
appropriate small form factor technologies and building blocks, SFF-SIG
sees Pico-ITX as an ideal platform for the new ultra mobility CPUs and
chipsets, highlighting the key benefits of smaller size, reduced power
consumption, and greater reliability over larger legacy products.
"Based on the positive customer interest and feedback so far, we see a
good opportunity to rapidly build the market for Pico-ITX by working
with the SFF-SIG to standardize it," said Daniel Wu, vice president, VIA
Technologies, Inc. "Pico-ITX was developed to meet the evolving needs of
the rapidly-expanding embedded industry, and its adoption by the SFF-SIG
will enable more concerted development of the specification and its
"Adopting Pico-ITX is the first step toward creating a unified embedded
platform for ultra mobility silicon," said Colin McCracken, president,
Small Form Factor SIG. "Our next order of business is to define the
SUMIT™ expansion interface. OEMs have requested both high-speed and
low-speed serial buses for space efficiency, with an emphasis on low
power and easy connectivity. We are working with chipset vendors to
determine how ultra mobility silicon can best meet these needs over a
ten year time horizon."
Companies interested in contributing to the development of the Pico-ITX
specification, or in defining other SBCs and computer-on-modules for the
new ultra mobility CPUs and chipsets should contact the SFF-SIG at:
About the Pico-ITX Form Factor
Representing the latest advance in board design, the Pico-ITX board form
factor is a complete, native x86 board measuring just 100mm x 72mm,
smaller than all existing standard industry form factors, and leverages
VIA's extensive expertise in miniaturization at the silicon level
through major advances in power efficiency, thermal management and
75% smaller than VIA's successful Mini-ITX form factor introduced six
years ago, the Pico-ITX truly embodies VIA's "Small is Beautiful"
technology design strategy of shrinking the form factor to drive the x86
platform into ever smaller systems and whole new embedded device
categories. For more information on the Pico-ITX form factor, please
visit the VIA website at: www.via.com.tw/en/initiatives/spearhead/pico-itx/
About the Small Form Factor SIG
The Small Form Factor Special Interest Group is an international
organization devoted to identifying, creating, and promoting standards
that help electronics system and device manufacturers and integrators
move to small form factor technologies and building blocks in their
products, and protect such investments. Benefits of small form factor
products include smaller size, reduced power consumption (eco-friendly,
"green" products), and greater reliability compared to larger legacy
The SIG's philosophy is to embrace the latest technologies, as well as
maintain legacy compatibility and enable smooth transition solutions to
next-generation interfaces. New technologies available to long-lifecycle
system and device manufacturers include lower power and highly
integrated processors, chipsets, and memory based on 90nm, 65nm, and
45nm processes, higher density connectors with improvements for
ruggedness, compact storage devices, and space-efficient signal interfaces.
Companies that can benefit from SFF-SIG membership include board
suppliers with existing small form factor specifications that they can
shepherd through the SIG's adoption and standardization process, or
companies who want to participate in the development of important new
standards that shape the evolution of electronics systems, or who are
planning to develop their own small form factor boards. OEMs and
integrators who simply need to stay abreast of off-the-shelf board
technologies or who want to have more control of their own destiny
regarding boards are also welcome. Discussing trends with some of the
sharpest minds in the industry can spark ideas that benefit individual
members with their own product roadmaps.
There are two membership categories for the SFF-SIG. Voting members are
involved in promoting, supporting, and developing specifications for
small form factor boards, components, and systems. In addition, voting
members review specifications that are submitted to the SFF-SIG for
adoption. Non-voting members provide inputs directly to internal
specification development, and can view these specifications prior to
publication, but do not cast approval votes.
For more information about the SFF-SIG, please visit www.sff-sig.org.
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power
efficient x86 processor platforms that are driving system innovation in
the PC, client, ultra mobile and embedded markets. Combining
energy-saving processors with digital media chipsets and advanced
connectivity, multimedia and networking silicon enables a broad spectrum
of computing and communication platforms, including its widely acclaimed
ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global
network links the high tech centers of the US, Europe and Asia, and its
customer base includes the world's top OEMs and system integrators.
Note to reporters, editors and writers: VIA is written in ALL CAPS.
The names of actual companies and products mentioned herein may be the
trademarks of their respective owners.