Once again, VIA is shrinking the PC motherboard. First they released the Mini-ITX form factor at 17cm x 17cm which is now commonly used on robots. Next came the Nano-ITX at 12cm x 12cm. The Nano-ITX, while sounding very promising for robotics use, was plagued with delays and when it finally became available was priced out of range for robot hobbyists. Today VIA announced the long rumored Pico-ITX, which is only 10cm x 7.2cm. VIA has managed to shrink everything you need on a PC motherboard down to two chips, a C7 or Eden CPU and a VX700 chip that combines all the I/O functionality. Speaking of I/O, the board has IDE and SATA connectors, 10/100 Ethernet, four USB 2 ports, audio and video ports, and one RS-232. Unlike the Mini-ITX, this board appears not to have an I2C port, so you'd need to add a microcontroller to get some additional I/O for robotics use. No pricing was announced, but with Atmel's recent release of a $69 Linux SBC, it will be interesting to see how competitive VIA can be. For more details see the Pico-ITX whitepaper (PDF format). Read on for the full text of today's press release from VIA.

VIA Technologies, Inc.

533 Chung Cheng Road 8F | Hsin Tien, Taipei | Taiwan
Tel: (8862) 2218-5452 | Fax: (8862) 2218-5453 | http://www.via.com.tw

For Immediate Release

VIA Defines Pico-ITX Form Factor, the World’s Smallest x86 Mainboard

Tiny 10cm x 7.2cm complete PC platform fits into palm of hand, more than 75% smaller than the Mini-ITX, embodies VIA’s “Small is Beautiful” strategy to inspire x86 system innovation

Taipei, Taiwan, 19 April 2007- VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announcedthe VIA VT6047 Pico-ITX form factor reference design, the smallest full-featured x86mainboard in the industry designed for a new world of ultra compact embedded PC systems and appliances.

The Pico-ITX form factor is the latest advance in VIA’s proven record on platform miniaturization. The Mini-ITX mainboard, at 17cm x 17cm, which recently celebrated its 5th anniversary as an industry standard form factor with wide marketadoption, was followed by the Nano-ITX form factor at 12cm x 12cm, exactly 50% of the size of the Mini-ITX. Now, the Pico-ITX, at 10cm x 7.2cm and 50% of the size of the Nano-ITX form factor, truly embodies VIA’s “Small is Beautiful” technology design strategy of shrinking the form factor to drive the x86 platform into ever smaller systems and whole new devicecategories.

Leveraging VIA’s extensive expertise in miniaturization at the silicon level through major advances in power efficiency, thermal management and feature integration, the VIA VT6047 Pico-ITX mainboard was designed to be powered by one of VIA’s energy efficient processor platforms, such as the VIA C7 or fanless VIA Eden processor in the21mm x 21mm nanoBGA2 package, combined with feature-rich VIA system media processors to enable the boardto pack a performance punch in a tiny, low heat, low power package.

“The Pico-ITX represents VIA’scommitment to spearhead x86 innovation through our proven technology leadership in driving down the platform size,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “As with the Mini-ITX and Nano-ITX form factors before it, this new platform has raised theexcitement level among enthusiasts and customers alike, firing the imagination an almost unlimited range of what were previously impossibly small systems.”

More details about the Pico-ITX form factor and the VIA VT6047 Pico-ITX mainboard reference design may be found in the “VIA Pico-ITX Form Factor” white paper, available for download from the VIA website at: http://www.via.com.tw/en/initiatives/spearhead/pico-itx/.

The VIA VT6047 Pico-ITX reference design has been successfully demonstrated during international trade shows this year, including during CES, CeBIT Germany and Embedded System Conference West. The VIA Platform Solutions Division will announce the first commercial mainboard based on the Pico-ITX form factor shortly.

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw

VIA PR Contact

International: Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886)-2-2218-5453
Email: RIBrown@via.com.tw

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